| Item |
Capability
parameters |
| Account of
layers |
Up
to 24Layers |
| Laminate
material |
FR-4,Halogen
free,High TG,PTFE,Aluminum BT,Rogers |
| Maximum board
size |
889*460mm(35*18inch) |
| Board thickness |
0.2-4.8mm |
| Minimum trace
width/space |
3/3mil(0.076mm) |
| Outer layer
finished copper thickness |
35-210um(1-6
OZ) |
| Inner layer
finished copper thickness |
18-105um(1-3
OZ) |
| Min.drill hole
diameter(Mechanical) |
0.2mm(8mil), Min pads for vias(16mil) |
| Min.drill hole
diameter (laser hole) |
0.1mm(4mil), Min pads for microvias(12mil) |
| Max spect ratio |
15:1 |
| Solder Mask
Color |
Green、Blue、Black、White、Yellow、Red LPI solder mask
AND Peelable Soldermask |
| Legend Colors |
White,
Yellow, Black |
| Min width of
Legend |
0.10mm(4mil,finished
CU less than 55um) |
| Min height of
Legend |
0.635mm(25mil,finished
CU less than 55um) |
| Impedance
control Tolerance |
+/-10%(above
50 Ohm),+/-5 Ohm(less than 50 Ohm) |
| Surface
Treatment |
Immersion
Gold,Leadfree HASL,Immersion Silver,Flash gold,OSP(Entek),Immsion Sn |
| V-Cut degree |
30º,45º,60º |
| The angle type
of the chamfer |
30º,45º,60º |
| Max.size can be
plugged by soldermask |
0.5mm |
| Largest NPTH
hole size |
6mm |
| Largest PTH hole
size |
6mm |
| Min.annular ring
can be kept |
0.15mm |
| Min.distance
between the IC pads can keep Sm bridge |
0.25mm(10mil) |
| Min.green solder
mask Bridge Between solder dam |
0.1mm(4mil) |
| Min.black solder
mask Bridge Between solder dam |
0.125mm(5mil) |
| Tolerance of dimension size |
+/-0.13mm |
| Tolerance of
board thickness |
+/-10%(above
1.0mm), +/-0.1mm(less than 1.0mm) |
| Tolerance of finished NPTH hole
size |
+/-0.05mm(+/-2mil) |
| Tolerance of
finished PTH hole size |
+/-0.076mm(+/-3mil) |
